Application of direct drive motors in the semiconductor industry

Objective trend: With the continuous development of semiconductor process and packaging technology, the core components of semiconductor manufacturing and packaging and testing equipment - motors, feedback devices, drive devices, control devices, optical paths, and vision requirements are getting higher and higher.

Core pain points: The technical bottlenecks of semiconductor equipment are mainly reflected in aspects such as accuracy, dynamics, stability and reliability. The existence of these problems directly affects the performance, efficiency and yield rate of the equipment.

In summary, direct drive motors are the most necessary choice for linear and rotary motion devices on high-end semiconductor industry equipment.

The silicon wafer manufacturing process requires highly precise positioning and motion control to ensure processing accuracy and stability. Direct-drive motors can provide high-resolution, high-precision position control, allowing silicon wafers to achieve higher manufacturing accuracy during processing. The characteristics of fast response and high speed are suitable for processes requiring high-speed processing in silicon wafer manufacturing, such as chamfering, grinding, cleaning, epitaxy and other steps. This helps increase production efficiency and reduce processing time. The structure is relatively simple, there is no transmission device, and there are few mechanical parts, so it has high reliability. In silicon wafer manufacturing, reliability is crucial, and the use of direct drive motors helps reduce failure rates and improve equipment stability.

Chamfering: A direct drive motor is used to drive the chamfering process. Through precise control, it can apply appropriate force on the edge of the silicon wafer to improve the strength of the silicon wafer and reduce chipping during processing. This chamfering process helps improve the stability of the silicon wafer.

Grinding: In silicon wafer manufacturing, direct drive motors drive the grinding process, providing high-precision position control to ensure the surface flatness and processing accuracy of the silicon wafer.

Cleaning: The cleaning process of silicon wafer manufacturing requires high-precision control. Direct-drive motors can provide precise movement to ensure that the cleaning fluid covers the surface of the silicon wafer to remove residual particles and impurities and ensure the quality of the silicon wafer.

Epitaxy: Direct drive motors can be used in epitaxy processes to ensure precise movement and positioning of silicon wafers during the epitaxy process to produce silicon wafers of the required size and shape.

Overall, the application of direct drive motors in silicon wafer manufacturing helps improve the silicon wafer manufacturing process and improve production efficiency and product quality by providing advantages such as high precision, high efficiency, low noise, and reliability.